Ijraset Journal For Research in Applied Science and Engineering Technology
Authors: Atish R Pande, Dr. Ankur Kapoor
DOI Link: https://doi.org/10.22214/ijraset.2023.48302
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The advent of smart materials such as piezoelectric (PZT) sensors has helped to revolutionize the field of structural health monitoring (SHM) based on NDT techniques. Currently, the effect of the thickness of the adhesive layer (Shear lag Effect) is considered insignificant in the practical application of EMI technology. Although a relatively new NDT method known as the electromechanical (EMI) technique has been studied for more than two decades, there are still a number of issues that must be resolved before it can be applied to real structures. A technique with significant potential to advance one of the most efficient SHM systems involves the use of a single PZT to excite and sense the host structure. This article reviews the research related to EMI technology over the past decade to understand its trend. It also compares new concepts and ideas proposed by other authors and ends the work with a discussion of possible directions for future work.
I. INTRODUCTION
SGM involves checking the response of a structure to current loads, taking into account environmental conditions. Evaluate any part of the structure [1] for non-uniformity, damage or performance. Continuous monitoring, feedback, and analysis of test data to facilitate decision making are key aspects of SHM [2]. Early detection of localized or premature damage prevents serious damage. The severity of the injuries ranges from local to severe. Moderate to severe damage is clearly visible, and this type of damage significantly alters the structure's vibrational response. Changes in the vibrational response, i.e. changes in mode shapes, modal frequencies, are detected using global methods. Local damage is difficult to detect with global techniques because frequency or shape deformation is not that important for local damage. Thus, local defect detection relies more on local techniques. Local class techniques are ultrasonic pulse velocity methods to detect structural strength, acoustic emissions, echo tests, etc. These are usually massive techniques and result in the extraction of some information, which is the history of the applied load and stress accumulation, which does not provide much information about the initial or local damage.
Investigating the shear gap effect of structure-attached or embedded PZT sensors is a difficult task because the bond layer thickness of a real structure-attached PZT sensor cannot be changed. This article focuses on studying the effect of adhesive layer thickness using a numerical approach. Therefore, a coupled system and tie-layer model were developed using FEM-based numerical models from ANSYS. After numerically extracting the signatures of the coupled system, further analyzes of the changes in the signatures were conducted to study the effect of the thickness of the tie layer on the accurate state prediction of the structure.
II. PROBLEM FORMULATION
Many researchers have studied the effect of the adhesive layer and found that the effect of the adhesive layer is significant. Therefore, the combined system signature must account for errors that occur at the communication layer. Monitoring a structure after it has been erected is just as important as during design or construction. A bad control structure can prevent many accidents. Structural health monitoring (SHM) plays an important role. Experts blindly analyze the old system. Various non-destructive tests (ND) are used for recreation, including hammer rebound and ultrasonic magnetic velocity tests. Another way to evaluate these sensory structures in Piezoelectric has also been discovered. Electromechanical impedance (EMI) technology using Piezoelectric materials is widely used for structural improvement at various stages. EMI hates damage, corrosion and the strength of certain structural parts.
III. OBJECTIVES
The primary objectives of this project can be summarized as follows:
IV. LITERATURE REVIEW
The growth of design activities in piezoelectric transducer development and industrial applications has led to the development of efficient and reliable simulation and design tools. Piezoelectric ceramic (PZT) chips are gaining popularity as sensors and actuators for non-destructive techniques (NDT) and structural health monitoring (SHM) due to their small form factor, cost-effectiveness and dual effect (both sensor and actuator effect).
In the electromechanical impedance (EMI) technique, a bonded PZT chip is electrically excited by applying an alternating voltage using an impedance analyzer/LCR meter. This causes localized deformation of both the chip and the surrounding host structure. The response in this region is returned to the PZT chip in the form of acceptance (electrical response) which includes conductance (real part) and susceptance (imaginary part). Any damage to the structure is shown as a deviation on the insert label for early detection.
Several researchers have studied the effect of the bonding layer and found that the effect of the adhesive layer is significant. Therefore, it is important to calculate the error due to the coupling layer in the signature of the coupled system. Monitoring a structure after it is built is just as important as during its design or construction. A properly controlled structure can prevent many catastrophic accidents. Structural health monitoring (SHM) has an important role. A preliminary analysis of expert systems was performed visually.
Investigating the shear delay effect of a structure-bonded or embedded PZT sensor is a difficult task because the bonding layer thickness of a bonded PZT sensor cannot be varied for a real structure. This project focuses on investigating the effect of bonding layer thickness using a numerical approach. Therefore, a model of the bonded system and bond layer was developed using a FEM-based numerical model in ANSYS. The signature of the coupled system was numerically extracted, and further analysis of the signature change was analyzed to investigate the effect of the bond layer thickness on the accurate prediction of the structural state.
V. PROJECT METHODOLOGY
EMF surface waves are generated by vibration or excitation of the PZT chip. These waves propagate radially outward. Waves Play detects any bugs or corruptions that prevent you from progressing. This technology uses PZTs connected or embedded in the main structure. Or heat the patch.
4. Construction of an analytically accurate analysis solution taking cleavage lag into account. Figure 2 presents the mean shift phenomenon. In the previous model, the inertial PZT effect was ignored, but it was considered when constructing the displacement gap model here.
5. The new model simultaneously considers potential differences and inertial effects. The new model's predictions fit the test more closely.
All countries spend a lot of money on construction. All social structures play an important role in the life and development of the people living in the country. Damage to such structures and systems affects the country\'s GDP, loses many lives and hinders the growing development of the country and its people. Structural strength is weakened by constant loads and environmental influences. Therefore, you should evaluate the performance of your design to see whether the performance is satisfactory. Structural damage can be prevented with proper monitoring. This review discusses electromagnetic interference techniques and focuses on the latest research in this field. Implementations still have many challenges to overcome, such as the limited sensing range of PZTs, selection of appropriate frequency ranges, temperature changes to be overcome to monitor damage, and accurate statistics to be accounted for.
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Copyright © 2023 Atish R Pande, Dr. Ankur Kapoor. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
Paper Id : IJRASET48302
Publish Date : 2022-12-22
ISSN : 2321-9653
Publisher Name : IJRASET
DOI Link : Click Here